Influence of wirebond shape on its lifetime with application to frame connections

  • Bernhard Czerny (Vortragende*r)

Aktivität: VorträgeVortragAndere

Zeitraum16 Apr. 2013
EreignistitelIEEE Int. Conf. on the Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems
VeranstaltungstypKonferenz
OrtWroclaw, PolenAuf Karte anzeigen