A fritless copper conductor system for power electronic applications

Roland Reicher (Korresp. Autor*in), Walter Smetana, Julius Schuster, Alexander Adlaßnig

Veröffentlichungen: Beitrag in FachzeitschriftArtikelPeer Reviewed

Abstract

Copper coated aluminium nitride (AlN) ceramic is a preferred substrate material utilized for high power, high frequency electronic applications. The use of metallized ceramic requires bonding of the metallization onto the substrate. AlN, however, is chemically inert to Cu. At present time the direct copper bonding (DCB) technology is used to manufacture such structures. In this project, for reasons of simplicity and economy and as alternative to the standard DCB-technology, the metallization on the AlN ceramic is built up by active metal brazing of a screen printable AgCuTi thick film ink. The mean advantage of this technology is, that the metal/ceramic braze compound can be processed in a conventional belt furnace at inert firing atmosphere usually available at hybrid microelectronics industry. Aspects of paste preparation ranging from the derivation of the metallic powder to the assortment of an appropriate organic screen-printing medium were investigated. The physical properties of the phases occurring at the interface between the TiCuAg metallization and AlN ceramic and their contribution to the thermal conductivity and the thermomechanical performance of the metallized substrate have been characterized theoretically as well as by experiment and compared with different commercial glass frit containing copper thick film metallization systems. Π2001 Elsevier Science B.V.
OriginalspracheEnglisch
Seiten (von - bis)491-498
Seitenumfang8
FachzeitschriftMicroelectronics Reliability
Jahrgang41
Ausgabenummer4
DOIs
PublikationsstatusVeröffentlicht - 2001

ÖFOS 2012

  • 104017 Physikalische Chemie

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