A New Approach for Evaluation of Fatigue Life of Al Wire Bonds in Power Electronics

Golta Khatibi, Martin Lederer, Bernhard Czerny, Agnieszka Betzwar-Kotas, Brigitte Weiss

Veröffentlichungen: Beitrag in BuchBeitrag in Konferenzband

Abstract

Ultrasonically bonded Al wirebonds on Al metallization pads are widely used in power semiconductors. The required long time reliability of the devices is highly dependent on the interfacial quality of Al wire and the bond pad. Reliability of wire bonds is commonly assessed by thermal and power cycling tests. Accelerated mechanical fatigue testing can be used as an alternative to these time consuming procedures. In the present study lifetime of thick Al wedge bonds on Si substrates was investigated using a novel mechanical fatigue testing technique operating at high frequencies and elevated temperatures. The influence of microstructure, testing temperature and frequency on lifetime of Alwirebonds was investigated. Finite element analysis was applied to calculate the stress distribution at the interfacial region and to establish life time prediction curves. The results of mechanical isothermal fatigue curves were compared and correated with thermal cycling data of Al wire bonds.
OriginalspracheEnglisch
TitelLight Metals 2014
Redakteure*innenJohn Grandfield
Herausgeber (Verlag)John Wiley & Sons, Inc.
Seiten271-277
Seitenumfang7
Band9781118889084
ISBN (elektronisch)9781118888438
ISBN (Print)9781118889084
DOIs
PublikationsstatusVeröffentlicht - 10 März 2014
VeranstaltungTMS 2014 143rd ANNUAL MEETING & EXHIBITION - San Diego, USA / Vereinigte Staaten
Dauer: 16 Feb. 201420 Feb. 2014

Konferenz

KonferenzTMS 2014 143rd ANNUAL MEETING & EXHIBITION
Land/GebietUSA / Vereinigte Staaten
OrtSan Diego
Zeitraum16/02/1420/02/14

ÖFOS 2012

  • 210006 Nanotechnologie

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