TY - JOUR
T1 - Cu-Ni-Sn: A Key System for Lead-Free Soldering
AU - Schmetterer, Clemens
AU - Flandorfer, Hans
AU - Luef, Christoph
AU - Kodentsov, Alexander A.
AU - Ipser, Herbert
N1 - Schmetterer, C., Flandorfer, H., Luef, Ch., Kodentsov, A., Ipser, H.
Department for Inorganic Chemistry/Materials Chemistry, University of Vienna, Waehringerstr. 42, Vienna 1090, Austria
PY - 2009
Y1 - 2009
N2 - Being the most complex constituent of the quaternary system Ag-Cu-Ni-Sn, the ternary system Cu-Ni-Sn is the key system for the investigation of the interactions of Ag-Cu-Sn solder alloys with Ni as a contact material. Although this system has been thoroughly studied in the literature, there are still many uncertainties left. In the present work, a study of the phase equilibria in four isothermal sections at 220, 400, 500, and 700°C of the Cu-Ni-Sn system was carried out following a comprehensive literature study. The methods employed were x-ray diffraction (XRD), metallography, and scanning electron microscopy including electron probe microanalysis. The ternary solubilities of the Ni 3Sn2-Cu6Sn5 and Ni 3Sn-Cu3Sn fields were characterized in detail. So far no continuous solubility between the respective phases has been found. At 25 at.% Sn the existence of two ternary compounds formed from the BiF3-type (Cu,Ni)3Sn phase and reported in literature could be confirmed. On the other hand, our results differ significantly from the very recent literature related to lead-free soldering.
AB - Being the most complex constituent of the quaternary system Ag-Cu-Ni-Sn, the ternary system Cu-Ni-Sn is the key system for the investigation of the interactions of Ag-Cu-Sn solder alloys with Ni as a contact material. Although this system has been thoroughly studied in the literature, there are still many uncertainties left. In the present work, a study of the phase equilibria in four isothermal sections at 220, 400, 500, and 700°C of the Cu-Ni-Sn system was carried out following a comprehensive literature study. The methods employed were x-ray diffraction (XRD), metallography, and scanning electron microscopy including electron probe microanalysis. The ternary solubilities of the Ni 3Sn2-Cu6Sn5 and Ni 3Sn-Cu3Sn fields were characterized in detail. So far no continuous solubility between the respective phases has been found. At 25 at.% Sn the existence of two ternary compounds formed from the BiF3-type (Cu,Ni)3Sn phase and reported in literature could be confirmed. On the other hand, our results differ significantly from the very recent literature related to lead-free soldering.
U2 - 10.1007/s11664-008-0522-4
DO - 10.1007/s11664-008-0522-4
M3 - Article
SN - 0361-5235
VL - 38
SP - 10
EP - 24
JO - Journal of Electronic Materials
JF - Journal of Electronic Materials
IS - 1
ER -