Effect of temperature on the surface properties of Cu-Sn liquid alloys

L C Prasad, Adolf Mikula

Veröffentlichungen: Beitrag in FachzeitschriftArtikelPeer Reviewed

Abstract

The concentration and temperature dependence of the surface tension and surface composition of Cu-Sn liquid alloys have been theoretically investigated with the application of statistical mechanical model based on layered structures. Our study suggests an increase in the surface tension (s) with the increase of Cu concentration. Maximum increase in s has been found around the compound forming concentration, i.e. Cu0.75Sn0.25. With regard to the effect of temperature on activity coefficient (?), our study shows positive temperature coefficient at compound forming concentration, i.e. CCu = 0.75. The temperature buffering (ds/dT = 0) was found to occur around the equi-atomic composition. It may be inferred that positive temperature coefficient might be due to progressive dissociation at the surface of atomic clusters/associates/complexes associated with the ?-phase of the system. So far as surface segregation is concerned, the surface is quite enriched with Sn-atoms at all bulk concentrations. However, the extent of segregation decreases with the increase of the temperature.
OriginalspracheEnglisch
Seiten (von - bis)193-197
Seitenumfang5
FachzeitschriftJournal of Alloys and Compounds
Jahrgang314
Ausgabenummer1-2
PublikationsstatusVeröffentlicht - 2001

ÖFOS 2012

  • 1040 Chemie

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