Nanostructure formation mechanism during in-situ consolidation of copper by room-temperature ball milling

M. Samadi Khoshkhoo (Korresp. Autor*in), S. Scudino, T. Gemming, J. Thomas, J. Freudenberger, M. Zehetbauer, C. C. Koch, J. Eckert

Veröffentlichungen: Beitrag in FachzeitschriftArtikelPeer Reviewed

Abstract

Bulk nanostructured Cu was prepared by in-situ consolidation through room temperature ball milling. The consolidated parts consist of hollow spheres having a diameter which increases with increasing the milling time. Microhardness maps reveal that the distribution of the hardness is relatively homogeneous after 2 h of milling. After 34 h the hardness is higher at the outer edge and decreases toward the inner edge and, finally, after 70 h the distribution is uniform again. Electron microscopic results show that the microstructure after 70 h of milling consists of two types of grains: elongated ultrafine grains with high density of defects and equiaxed nanosized grains produced by dynamic recrystallization. Continuous dynamic recrystallization is the dominant mechanism for the formation of the nanosized grains. Evidence for the occurrence of discontinuous dynamic recrystallization through twinning was also found in a few regions of the in-situ consolidated samples.
OriginalspracheEnglisch
Seiten (von - bis)1083-1090
Seitenumfang8
FachzeitschriftMaterials & Design
Jahrgang65
DOIs
PublikationsstatusVeröffentlicht - Jan. 2015

ÖFOS 2012

  • 210004 Nanomaterialien

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