The density and surface tension of In-Sn and Cu-In-Sn alloys

Zhongnan Guo (Korresp. Autor*in), Michael Hindler, Wenxia Yuan, Adolf Mikula

Veröffentlichungen: Beitrag in FachzeitschriftArtikelPeer Reviewed

Abstract

The density and surface tension of binary In-Sn and ternary Cu-In-Sn alloys have been measured by a sessile-drop method. Decrease of the density and of the surface tension was observed with rising temperature. With increased Sn content in the alloys, the density increased while the surface tension reduced slightly. Addition of Cu could significantly increase the density and surface tension in the Cu-In-Sn system. The surface tension of the Cu-In-Sn alloys was also calculated by means of Butler's equation, and compared with experimental values, showing good agreement.
OriginalspracheEnglisch
Seiten (von - bis)579-584
Seitenumfang6
FachzeitschriftMonatshefte für Chemie
Jahrgang142
Ausgabenummer6
PublikationsstatusVeröffentlicht - 2011

ÖFOS 2012

  • 104003 Anorganische Chemie
  • 104011 Materialchemie

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