Feature-Scale Modeling of Low-Bias SF6 Plasma Etching of Si

Luiz Felipe Aguinsky; Georg Wachter; Francio Rodrigues; Alexander Scharinger; Alexander Toifl; Michael Trupke; Ulrich Schmid; Andreas Hoessinger; Josef Weinbub

doi:10.1109/EuroSOI-ULIS53016.2021.9560685

Feature-Scale Modeling of Low-Bias SF₆ Plasma Etching of Si

Luiz Felipe Aguinsky (Corresponding author)
, Georg Wachter
, Francio Rodrigues
, Alexander Scharinger
, Alexander Toifl
, Michael Trupke
, Ulrich Schmid
, Andreas Hoessinger
, Josef Weinbub

Quantum Science

Publications: Contribution to book › Contribution to proceedings › Peer Reviewed

Original language	English
Title of host publication	2021 Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (EuroSOI-ULIS)
Publisher	IEEE
Pages	1-4
Number of pages	4
ISBN (Electronic)	978-1-6654-3745-5
ISBN (Print)	978-1-6654-3746-2
DOIs	https://doi.org/10.1109/EuroSOI-ULIS53016.2021.9560685
Publication status	Published - 2021
Event	Joint International EUROSOI Workshop / International Conference on Ultimate Integration on Silicon (EuroSOI-ULIS) - Caen, France Duration: 1 Sept 2021 → 3 Sept 2021

Publication series

Series	International Conference on Ultimate Integration on Silicon
ISSN	2330-5738

Conference

Conference	Joint International EUROSOI Workshop / International Conference on Ultimate Integration on Silicon (EuroSOI-ULIS)
Country/Territory	France
City	Caen
Period	1/09/21 → 3/09/21

Funding

The financial support by the Austrian Federal Ministry for Digital and Economic Affairs, the National Foundation for Research, Technology and Development, and the Christian Doppler Research Association is gratefully acknowledged. M. Trupke and G. Wachter gratefully acknowledge support from the EU H2020 framework programme (QuanTELCO, 862721), the FWF (SiC-EiC, I 3167-N27), and the FFG (QSense4Power, 877615).

Austrian Fields of Science 2012

103011 Semiconductor physics
202028 Microelectronics

Keywords

Plasma etching
process TCAD
topography simulations
ray-tracing
level-set method
SF6 plasma
SF plasma

Access to Document

10.1109/EuroSOI-ULIS53016.2021.9560685

Cite this

Aguinsky, L. F., Wachter, G., Rodrigues, F., Scharinger, A., Toifl, A., Trupke, M., Schmid, U., Hoessinger, A., & Weinbub, J. (2021). Feature-Scale Modeling of Low-Bias SF₆ Plasma Etching of Si. In 2021 Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (EuroSOI-ULIS) (pp. 1-4). IEEE. https://doi.org/10.1109/EuroSOI-ULIS53016.2021.9560685

@inproceedings{ef15c44984bf4f8fa73bcdf24fb1e92f,

title = "Feature-Scale Modeling of Low-Bias SF6 Plasma Etching of Si",

keywords = "Plasma etching, process TCAD, topography simulations, ray-tracing, level-set method, SF6 plasma, SF plasma",

author = "Aguinsky, \{Luiz Felipe\} and Georg Wachter and Francio Rodrigues and Alexander Scharinger and Alexander Toifl and Michael Trupke and Ulrich Schmid and Andreas Hoessinger and Josef Weinbub",

note = "Publisher Copyright: {\textcopyright} 2021 IEEE.; Joint International EUROSOI Workshop / International Conference on Ultimate Integration on Silicon (EuroSOI-ULIS) ; Conference date: 01-09-2021 Through 03-09-2021",

year = "2021",

doi = "10.1109/EuroSOI-ULIS53016.2021.9560685",

language = "English",

isbn = "978-1-6654-3746-2",

series = "International Conference on Ultimate Integration on Silicon",

publisher = "IEEE",

pages = "1--4",

booktitle = "2021 Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (EuroSOI-ULIS)",

}

Aguinsky, LF, Wachter, G, Rodrigues, F, Scharinger, A, Toifl, A, Trupke, M, Schmid, U, Hoessinger, A & Weinbub, J 2021, Feature-Scale Modeling of Low-Bias SF₆ Plasma Etching of Si. in 2021 Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (EuroSOI-ULIS). IEEE, International Conference on Ultimate Integration on Silicon, pp. 1-4, Joint International EUROSOI Workshop / International Conference on Ultimate Integration on Silicon (EuroSOI-ULIS), Caen, France, 1/09/21. https://doi.org/10.1109/EuroSOI-ULIS53016.2021.9560685

Feature-Scale Modeling of Low-Bias SF₆ Plasma Etching of Si. / Aguinsky, Luiz Felipe (Corresponding author); Wachter, Georg; Rodrigues, Francio et al.
2021 Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (EuroSOI-ULIS). IEEE, 2021. p. 1-4 (International Conference on Ultimate Integration on Silicon).

Publications: Contribution to book › Contribution to proceedings › Peer Reviewed

TY - GEN

T1 - Feature-Scale Modeling of Low-Bias SF6 Plasma Etching of Si

AU - Aguinsky, Luiz Felipe

AU - Wachter, Georg

AU - Rodrigues, Francio

AU - Scharinger, Alexander

AU - Toifl, Alexander

AU - Trupke, Michael

AU - Schmid, Ulrich

AU - Hoessinger, Andreas

AU - Weinbub, Josef

PY - 2021

Y1 - 2021

KW - Plasma etching

KW - process TCAD

KW - topography simulations

KW - ray-tracing

KW - level-set method

KW - SF6 plasma

KW - SF plasma

UR - https://www.scopus.com/pages/publications/85118404509

U2 - 10.1109/EuroSOI-ULIS53016.2021.9560685

DO - 10.1109/EuroSOI-ULIS53016.2021.9560685

M3 - Contribution to proceedings

SN - 978-1-6654-3746-2

T3 - International Conference on Ultimate Integration on Silicon

SP - 1

EP - 4

BT - 2021 Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (EuroSOI-ULIS)

PB - IEEE

T2 - Joint International EUROSOI Workshop / International Conference on Ultimate Integration on Silicon (EuroSOI-ULIS)

Y2 - 1 September 2021 through 3 September 2021

ER -

Aguinsky LF, Wachter G, Rodrigues F, Scharinger A, Toifl A, Trupke M et al. Feature-Scale Modeling of Low-Bias SF₆ Plasma Etching of Si. In 2021 Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (EuroSOI-ULIS). IEEE. 2021. p. 1-4. (International Conference on Ultimate Integration on Silicon). doi: 10.1109/EuroSOI-ULIS53016.2021.9560685

Feature-Scale Modeling of Low-Bias SF₆ Plasma Etching of Si

Publication series

Conference

Funding

Austrian Fields of Science 2012

Keywords

Access to Document

Other files and links

Fingerprint

QuanTELCO: Quantum Emitters for Telecommunication in the O-Band

SiC-EiC: Quantum control of spin centers in silicon carbide with microcavities

Cite this

Feature-Scale Modeling of Low-Bias SF6 Plasma Etching of Si

Publication series

Conference

Funding

Austrian Fields of Science 2012

Keywords

Access to Document

Other files and links

Fingerprint

Projects

QuanTELCO: Quantum Emitters for Telecommunication in the O-Band

SiC-EiC: Quantum control of spin centers in silicon carbide with microcavities

Cite this

Feature-Scale Modeling of Low-Bias SF₆ Plasma Etching of Si