Interdiffusion and atomic mobility in FCC Ag–Cu–Ni alloys

Juan Chen, Shuhong Liu (Corresponding author), Qianhui Min, Shipeng Huang, Klaus W. Richter, Jieqiong Hu, Ming Xie, Yong Du

Publications: Contribution to journalArticlePeer Reviewed

Abstract

In the present work, the diffusion behavior of the Ag–Cu–Ni alloys was comprehensively studied for the first time. Twelve solid-solid diffusion couples were prepared and annealed at 1023, 1123, and 1223K, respectively. Based on the measured composition-distance profiles, the interdiffusion coefficients in FCC Ag–Cu–Ni alloys at different temperatures were then calculated by both the Matano-Kirkaldy (MK) and numerical inversion (NI) methods. The atomic mobilities of the Ag–Cu–Ni alloys were also optimized. The results indicate that the model-predicted diffusion behavior shows reasonable agreement with the experimental data, validating the reliability of the two versions of atomic mobility obtained in this work and demonstrating the accuracy and efficiency of the NI method. Ag diffuses faster than Ni in the Cu matrix alloy. The pre-exponential factor D0Ag and the activation energy QAgAgCu show a slight change with the Ag, but significantly increase with the Ni. The variation of the pre-exponential factor D0Ni and the activation energy QNiNiCu with the concentration of Ag and Ni were presented with a 3-D planes and discussed in detail. The accurate diffusivities and atomic mobilities of FCC Ag–Cu–Ni alloys obtained in this work will provide crucial input for the development and design of multi-component low-Ag brazing filler metals.

Original languageEnglish
Pages (from-to)3795-3804
Number of pages10
JournalJournal of Materials Research and Technology
Volume29
DOIs
Publication statusPublished - 1 Mar 2024

Austrian Fields of Science 2012

  • 104017 Physical chemistry
  • 104011 Materials chemistry
  • 103018 Materials physics

Keywords

  • Ag–Cu–Ni alloy
  • Atomic mobility
  • Brazing filler metals
  • CALTPP
  • Interdiffusion

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