@article{b5a4d2f88cd646649dd899310ece5d54,
title = "Nanocomposite SAC solders: morphology, electrical and mechanical properties of Sn-3.8Ag-0.7Cu solders by adding Co nanoparticles",
keywords = "LEAD-FREE SOLDERS, AG-CU SOLDER, TIO2 NANOPARTICLES, COMPOSITE SOLDER, MICROSTRUCTURE, JOINTS, RESISTIVITY, ALLOYS, PARTICLES, HARDNESS",
author = "A. Yakymovych and Yu Plevachuk and P Svec and D. Janickovic and P. Sebo and N. Beronska and M. Nosko and L. Orovcik and A. Roshanghias and H. Ipser",
note = "Publisher Copyright: {\textcopyright} 2017, The Author(s).",
year = "2017",
month = aug,
doi = "10.1007/s10854-017-6877-7",
language = "English",
volume = "28",
pages = "10965--10973",
journal = "Journal of Materials Science: Materials in Electronics",
issn = "0957-4522",
publisher = "Springer",
number = "15",
}