Nanocomposite SAC solders: morphology, electrical and mechanical properties of Sn-3.8Ag-0.7Cu solders by adding Co nanoparticles

A. Yakymovych (Corresponding author), Yu Plevachuk, P Svec, D. Janickovic, P. Sebo, N. Beronska, M. Nosko, L. Orovcik, A. Roshanghias, H. Ipser

Publications: Contribution to journalArticlePeer Reviewed

Original languageEnglish
Pages (from-to)10965-10973
Number of pages9
JournalJournal of Materials Science: Materials in Electronics
Volume28
Issue number15
DOIs
Publication statusPublished - Aug 2017

Austrian Fields of Science 2012

  • 104011 Materials chemistry
  • 103018 Materials physics

Keywords

  • LEAD-FREE SOLDERS
  • AG-CU SOLDER
  • TIO2 NANOPARTICLES
  • COMPOSITE SOLDER
  • MICROSTRUCTURE
  • JOINTS
  • RESISTIVITY
  • ALLOYS
  • PARTICLES
  • HARDNESS

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