Nanocomposite SAC solders: the effect of heat treatment on the morphology of Sn-3.0Ag-0.5Cu/Cu solder joints reinforced with Ni and Ni-Sn nanoparticles

Andriy Yakymovych (Corresponding author), Yuriy Plevachuk (Corresponding author), Lubomir Orovcik, Peter Svec

Publications: Contribution to journalArticlePeer Reviewed

Original languageEnglish
Pages (from-to)977-982
Number of pages6
JournalApplied nanoscience
Volume12
Issue number4
Early online date10 Mar 2021
DOIs
Publication statusPublished - Apr 2022

Austrian Fields of Science 2012

  • 104003 Inorganic chemistry
  • 205004 Functional materials
  • 210006 Nanotechnology

Keywords

  • Metal nanoparticles
  • SAC305 solder
  • Microstructure
  • Thermal treatment

Cite this