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Phenomenological modeling of low-bias sulfur hexafluoride plasma etching of silicon

  • Luiz Felipe Aguinsky (Corresponding author)
  • , Frâncio Rodrigues
  • , Georg Wachter
  • , Michael Trupke
  • , Ulrich Schmid
  • , Andreas Hössinger
  • , Josef Weinbub

Publications: Contribution to journal › Article › Peer Reviewed

Original languageEnglish
Article number108262
Number of pages8
JournalSolid-State Electronics
Volume191
DOIs
Publication statusPublished - May 2022

Funding

The financial support by the Austrian Federal Ministry for Digital and Economic Affairs, the National Foundation for Research, Technology and Development and the Christian Doppler Research Association is gratefully acknowledged. M. Trupke and G. Wachter gratefully acknowledge support from the EU H2020 framework programme (QuanTELCO, 862721), the FWF (SiC-EiC, I 3167-N27), and the FFG (QSense4Power, 877615). The authors acknowledge TU Wien Bibliothek for financial support through its Open Access Funding Program.

Austrian Fields of Science 2012

  • 103021 Optics
  • 202028 Microelectronics

Keywords

  • Isotropic etching
  • MEMS
  • Microfabrication
  • Optical devices
  • SF plasma etching
  • Topography simulations
  • FLUX CALCULATION
  • <p>SF(6 )plasma etching</p>

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