Abstract
The stress - strain behavior of thin copper wires in the range 20-250 œm diameter and various purities (3N, 5N) have been investigated. The wires were subjected to a recrystallization heat treatment and tensile properties were determined. Tensile testing was performed using a microtensile testing machine equipped with a non-contacting laser-optical speckle correlation sensor adapted for high-resolution strain measurement. The fracture elongation of all specimens exhibited lower values than that of bulk Cu with a decreasing trend for thinner wires. High-purity wires with a pronounced bamboo structure showed a size dependence of the yield strength which increased with decreasing wire diameter. Surface topography and fracture surfaces of the specimens were examined. The microstructural investigations were performed to arrive at an understanding and interpretation of our experimental results.
| Original language | English |
|---|---|
| Pages (from-to) | 749-753 |
| Number of pages | 5 |
| Journal | International Journal of Materials Research |
| Volume | 94 |
| Issue number | 6 |
| Publication status | Published - 2003 |
Austrian Fields of Science 2012
- 104017 Physical chemistry