| Original language | English |
|---|---|
| Pages (from-to) | 8856-8869 |
| Number of pages | 14 |
| Journal | RSC Advances |
| Volume | 8 |
| Issue number | 16 |
| DOIs | |
| Publication status | Published - 2018 |
Funding
This work was supported by the Austrian Science Fund (FWF) [grant numbers P 26304 and P 27049]. The authors want to acknowledge the help of Prof. M. Zehetbauer and Prof. E. Scha. er from the Faculty of Physics, University of Vienna, with the Sn-4.1Ag-1.3Cu foil preparation, Ing. C. Mitterer from the Faculty of Chemistry, University of Vienna, with BET analysis and Dr St. Puchegger from the Faculty of Physics, University of Vienna, with the SEM studies. TEM analysis was performed using the facilities at the University Service Center for Transmission Electron Microscopy at the Vienna University of Technology. The work by G.K. was supported by project GINOP 2.3.2 - 15 - 2016 - 00027 financed in the framework of the Szechenyplan supported by the European Union.
Austrian Fields of Science 2012
- 104003 Inorganic chemistry
- 104011 Materials chemistry
Keywords
- LEAD-FREE SOLDER
- GIBBS FREE-ENERGY
- SN ALLOYS
- NI NANOPARTICLES
- CU-SN
- ENTHALPIES
- SYSTEMS
- SIZE
- MICROSTRUCTURE
- MORPHOLOGY