Thermodynamic investigation of the Ni-rich side of the Ni-P system

Simona Delsante; Clemens Schmetterer; Herbert Ipser; Gabriella Borzone

doi:10.1021/je100166z

Thermodynamic investigation of the Ni-rich side of the Ni-P system

Simona Delsante, Clemens Schmetterer, Herbert Ipser, Gabriella Borzone (Corresponding author)

Department of Functional Materials and Catalysis

Publications: Contribution to journal › Article › Peer Reviewed

Abstract

Ni(P) is used in electronics as a protective layer during the soldering process. New thermodynamic information on Ni-P alloys has been obtained in the Ni-rich part (up to the molar fraction xP = 0.40) by using a high-temperature direct drop calorimeter. The experimental trend of ?fH° [kJ· (mol of atoms)-1] of the Ni-P alloys versus composition (xP) has been plotted and the following standard enthalpy of formation [?fH° ± 2 kJ· (mol of atoms)-1] values interpolated for the Ni-rich phases: -48.0 (Ni3P), -55.0 (Ni5P2), -56.0 (Ni 12P5), and -61.0 (NiP2). Our results have been compared with those reported in the literature and discussed.

Original language	English
Pages (from-to)	3468-3473
Number of pages	6
Journal	Journal of Chemical and Engineering Data
Volume	55
Issue number	9
DOIs	https://doi.org/10.1021/je100166z
Publication status	Published - 2010

Austrian Fields of Science 2012

104003 Inorganic chemistry
203024 Thermodynamics

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10.1021/je100166z

Cite this

@article{3685a620eb414b92b1d4aa4e540b189e,

title = "Thermodynamic investigation of the Ni-rich side of the Ni-P system",

abstract = "Ni(P) is used in electronics as a protective layer during the soldering process. New thermodynamic information on Ni-P alloys has been obtained in the Ni-rich part (up to the molar fraction xP = 0.40) by using a high-temperature direct drop calorimeter. The experimental trend of ?fH° [kJ· (mol of atoms)-1] of the Ni-P alloys versus composition (xP) has been plotted and the following standard enthalpy of formation [?fH° ± 2 kJ· (mol of atoms)-1] values interpolated for the Ni-rich phases: -48.0 (Ni3P), -55.0 (Ni5P2), -56.0 (Ni 12P5), and -61.0 (NiP2). Our results have been compared with those reported in the literature and discussed.",

author = "Simona Delsante and Clemens Schmetterer and Herbert Ipser and Gabriella Borzone",

year = "2010",

doi = "10.1021/je100166z",

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journal = "Journal of Chemical and Engineering Data",

issn = "0021-9568",

publisher = "AMER CHEMICAL SOC",

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T1 - Thermodynamic investigation of the Ni-rich side of the Ni-P system

AU - Delsante, Simona

AU - Schmetterer, Clemens

AU - Ipser, Herbert

AU - Borzone, Gabriella

PY - 2010

Y1 - 2010

N2 - Ni(P) is used in electronics as a protective layer during the soldering process. New thermodynamic information on Ni-P alloys has been obtained in the Ni-rich part (up to the molar fraction xP = 0.40) by using a high-temperature direct drop calorimeter. The experimental trend of ?fH° [kJ· (mol of atoms)-1] of the Ni-P alloys versus composition (xP) has been plotted and the following standard enthalpy of formation [?fH° ± 2 kJ· (mol of atoms)-1] values interpolated for the Ni-rich phases: -48.0 (Ni3P), -55.0 (Ni5P2), -56.0 (Ni 12P5), and -61.0 (NiP2). Our results have been compared with those reported in the literature and discussed.

AB - Ni(P) is used in electronics as a protective layer during the soldering process. New thermodynamic information on Ni-P alloys has been obtained in the Ni-rich part (up to the molar fraction xP = 0.40) by using a high-temperature direct drop calorimeter. The experimental trend of ?fH° [kJ· (mol of atoms)-1] of the Ni-P alloys versus composition (xP) has been plotted and the following standard enthalpy of formation [?fH° ± 2 kJ· (mol of atoms)-1] values interpolated for the Ni-rich phases: -48.0 (Ni3P), -55.0 (Ni5P2), -56.0 (Ni 12P5), and -61.0 (NiP2). Our results have been compared with those reported in the literature and discussed.

U2 - 10.1021/je100166z

DO - 10.1021/je100166z

M3 - Article

VL - 55

SP - 3468

EP - 3473

JO - Journal of Chemical and Engineering Data

JF - Journal of Chemical and Engineering Data

SN - 0021-9568

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