Tin Pest in Sn-0.5Cu Lead-Free Solder Alloys: A Chemical Analysis of Trace Elements

Monika Leodolter-Dvorak, Ilse Steffan, William J. Plumbridge, Herbert Ipser (Corresponding author)

Publications: Contribution to journalArticlePeer Reviewed

Abstract

Two samples of Sn-0.5Cu solder alloys, stored at -18°C for 7 years, were chemically analyzed by an inductively coupled plasma-optical emission spectroscopy method. One of the samples was unaffected by this exposure; the other one had completely transformed into brittle ?-Sn. Ten elements were found to exhibit statistically significant differences in their concentrations between the two samples, with the higher always associated with the untransformed sample. The highest concentrations were found for elements with an appreciable solubility in Sn, i.e., Bi, In, Pb, and Sb.
Original languageEnglish
Pages (from-to)105-108
Number of pages4
JournalJournal of Electronic Materials
Volume39
Issue number1
DOIs
Publication statusPublished - 2010

Austrian Fields of Science 2012

  • 104003 Inorganic chemistry
  • 104011 Materials chemistry

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